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On the road of highly integrated LED display packaging, who can take the lead in five packaging technologies?

21.02.2020 10:13

 
 
In the past year, due to the development of LED display technology, the industry has fully discussed the multi-dimensional development of LED display products. Instead, the discussion on packaging technology, the threshold for entering the LED display industry, has not been formed. System discussion. Last year, with the efforts of various LED screen companies, COB technology has been expanded and applied, and the technology has fully blossomed; IMD (all-in-one) technology has matured, and two advanced technologies have led the development trend of the LED display packaging industry. And lead the industry to show the trend of development towards packaging integration. So in the torrent of industry development, who can take the lead in these two technologies?
LED display started from packaging. After decades of development, five major packaging technologies such as DIP, SMD, IMD, COB, and massive transfer have been derived, which are suitable for chip packaging with different dot pitches. The five major packaging technologies co-exist, each with its own characteristics and application market. Why is the packaging industry starting to move towards integration? Led exhibition is analyzed from the perspective of the five major technology application characteristics.
 

Technical interpretation

DIP technology, the lamp beads are directly inserted into the PCB board, and then made into a display module by soldering, which is a plug-in package.
SMD technology is a single or multiple LED chips, which are welded to a metal bracket with a plastic "cup-shaped" frame through a machine, and then the liquid packaging glue is filled into the plastic frame. Paste the package.
IMD all-in-one packaging technology integrates two or more pixel structures in one packaging unit. Currently, the four-in-one technology is the most mature and belongs to integrated packaging technology.
COB packaging technology, which integrates multiple LED bare chips with conductive or non-conductive adhesive, is directly adhered and packaged on the PCB board, eliminating the need for a bracket and completely sealing the entire module, which is a highly integrated packaging technology. In addition, COB packaging reduces the process of lamp beads and reflow soldering. It integrates upstream, middle, and downstream technologies, combines lamp beads and PCB panel packaging, from LED chip packaging to the production of LED display unit modules or displays. Completed by one enterprise, it requires close cooperation between upstream, midstream and downstream enterprises. This is the integration of production processes.
Mini / Micro LED display technology highly integrates millions of wafers together, that is, a huge amount of transfer technology, so it also belongs to highly integrated packaging technology. Combining the above and the development history of packaging technology, we can see that LED display packaging technology is moving towards integration.
 

Application prospect analysis

As the oldest packaging technology, DIP has been in the field of vertical and horizontal packaging for decades. With its advantages of simple process and low cost, DIP has a high market share. However, this technology requires manual direct insertion, which is inefficient, and is only suitable for outdoor displays above P10. With the overall display screen going below 10 and the replacement wave set off by the early aging of LED screens, the DIP technology market has severely shrunk and has withdrawn from the main stage of the packaging industry history.
SMD is suitable for the packaging of dot spacing between P2 and P10. It is also the current mainstream packaging technology in the packaging industry. It has the advantages of mature technology and high surface mount efficiency of the machine, and it has performance in brightness, consistency, reliability, viewing angle, appearance, etc. good. However, due to the existence of the congenital stent problem, it has problems such as poor air tightness, poor heat dissipation, uneven luminescence, and decreased luminous efficiency. Although the research and discussion of many companies have not been able to completely solve this problem. In addition, in the past two years, the capacity of conventional SMD packaged conventional chips has been severely excessive, which has affected Taiwan, Japan, and South Korea. Prices have fallen and profits have fallen sharply. At the same time, the LED conventional display market has also become saturated and conventional lamp beads have been shipped Difficult, the chip packaging industry has entered a bottleneck period of development. Difficult to ship, high inventory, and sluggish industry status. Enterprises have been attacked on three sides, and new development momentum is urgently needed to get rid of development difficulties.
At this time, due to the increasing demand for personalization, the market in various segments began to exert force. Among them, the small-pitch LED display screen has risen strongly due to the expansion of the security market and has become a profit point for major companies. Enterprise deployment is also keeping an eye on the small-pitch lamp beads, and the small-pitch plan is carried out in an orderly manner. Although SMD is the most common packaging technology in the industry, when the package size is less than 2.0, it is limited by the die bonding, wire bonding, dicing (die-cutting), and precision of the wire bonding equipment, which will cause the process difficulty to increase dramatically. Yields are reduced and terminal costs are increased. Therefore, it is difficult for SMD packages to enter the small-pitch packaging market, which is the most profitable. SMD technology is not suitable for small-pitch packaging, prompting the birth of another packaging technology with the same root source, IMD all-in-one integrated packaging technology.
COB packaging and IMD technology have several common features. First, both can break through the limitations of SMD technology and reduce the pixel pitch to less than 2.0mm. Second, both technologies are also derived from the small-pitch LED display technology. Development, and are also mainly used in the field of small-pitch LED display. By analogy, since COB and IMD technology can be applied to small-pitch LED display products, it can also be applied to large-pitch LED display. It is undeniable that due to its inherent defects, COB technology will have cost problems when applied to large-screen products. However, IMD technology originates from SMD. It inherits SMD's experience, technology, equipment and production lines. The application cost is relatively low, and it can be extended to a pitch of more than 2.0. In addition, COB packaging and IMD technology have been the most discussed topics in the packaging industry in the past two years. The feasibility, reliability, production yield, and scope of application of the two have been explored. The two technologies have continued to deepen and promote Both are moving towards a more stable and mature application phase. Therefore, it is not impossible for the future SMD to be replaced by IMD technology.
Mini / Micro LED displays that the technology is relatively advanced, and there are many technical difficulties to be overcome. The biggest difficult technology has not been studied and a good solution has been developed. In addition, Mini / Micro LED displays have not yet formed a corresponding industry chain. Even if Mini / Micro LED display trends become hot in the future, they still have a long way to go.
From the perspective of application scenarios, conventional screens have entered the platform stage. Although market segments are also in the expansion stage, the development momentum and application scope of small pitches are even better. Moreover, with the further implementation of smart city policies, the security surveillance market will continue to expand; in addition, with the popularity of 5G networks, conference visualization has also begun to enter the conference rooms of major companies; not only that, companies in major sub-sectors also Began to explore the possibility of displaying its products in small pitches, and relatively mature products have also appeared on the market. The development trend of several major trends is huge and will continue to drive the development of small-pitch LED displays. Therefore, the small-pitch display field that can be expected in the future will become the majority of LED packaging companies, and even the first choice of strategic layout of LED screen companies. It can be seen that the LED display package is also quietly moving towards integration.
From a technical perspective, SMD, COB, and IMD took the lead, and from the perspective of development, COB, IMD, and Mini / Micro LED can be expected in the future, but Mini / Micro LED has not yet formed certain development, so COB and IMD stand out. From this comprehensive analysis, it is concluded that the five major packaging technologies, COB and IMD, will take the lead.
 

Conclusion:

COB and IMD technologies have their own advantages. How to choose is the issue that most packaging companies and LED screen companies consider. Although COB has a high packaging cost, it reduces the traditional solid crystal process, reduces weight, and can be developed in a lighter and thinner direction. However, entering the COB field requires repurchasing equipment, production lines, etc., and requires enterprises to have deep financial strength. The IMD technology can continue to use SMD equipment, production lines, and personnel experience, and can be extended to more than 2.0 fields. Therefore, the IMD field is more suitable for the development of packaging companies. Since the trend of integrated packaging is irreversible, choose the right way to go.
 
Source: HC LED Screen Network